EE 410/510 - Microfabrication & Semiconductor Processes
(Dr. John Williams, Fall 2008)
[course notes listed below]
Dr. J. D. Williams 406 Optics Building (256) 824 – 2898 firstname.lastname@example.org
Mark Madou, Fundamentals of Microfabrication: The Science of Miniaturization, 2nd ed., CRC Press, Boca Raton, 2002.
- Ashby, Shercliff, and Cebon, Materials Engineering, Science, Processing , and Design, Elsevier, Amsterdam, 2007.
- Wolf and Tauber, Silicon Processing for the VLSI Era, Vol1: Process Technology, 2nd ed., Lattice Press, 1999.
- Cambell, The Science and Engineering of Microelectronic Fabrication, 2nd ed., Oxford, NY, 2004.
- Moreau, Semiconductor Lithography: Principles, Practices, and Materials, Plenum Press, NY 1998.
- Mack, Fundamentals Principles of Optical Lithography: Science of Microfabrication, Wiley Interscience, NY, 2008.
- Lieberman, and Lichtenberg, Principles of Plasma Discharges and Materials Processing, Wiley Interscience, NY, 1994.
- Brodie, Physics of Micro/Nano-Fabrication, Plenum Press, NY, 1993.
- Ohring, Material Science of Thin Films: Deposition and Structure, 2nd ed., Academic Press, San Diego, 2002.
- Kovacs, Micromachined Transducers Sourcebook, McGraw Hill, Boston, 1998.
- Maluf and Williams, An Introduction to Micrloelectromechanical Systems Engineering, 2nd ed., Artech, Norwood, MA , 2004.
- Staff edited, CNF Nanocourses, Cornell Nanoscale Science and Technology Facility, 1998-2008
- Goddard, et al., Handbook of Nanoscience Engineering and Technology, CRC Press, 2002.
- Bhushan, Handbook of Nano-technology, 2nd ed., Springer Verlag, 2006.
- Proceedings of the SPIE (largest series of conference proceedings in optics, photonics, plasmonics, and MEMS)
- IEEE Transactions (several journals representing different topics), IEEE Press
- Sensors and Actuators (A & B), Elsevier Publishing
- Journal of Microelectromechanical Systems, IEEE Press
- Journal of Micromechanics, and Microengineering, IOP Press
- Journal of Micro/Nanolithography, MEMS, and MOEMS, SPIE Press
- Science Magazine, AAA Press
- Nature, Nature
- Journal of the American Vacuum Society (A & B), AVS Press
- Journal of the Electrochemical Society, AIP Press
- Journal of Applied Physics, AIP Press
One year of Physics, One year of Chemistry, Calculus (I,II, III),
Helpful but not required:
Introduction to Differential Equations
- Review of early developments in Microfabrication Process Engineering
- Introduction to Material Science for device fabrication
- Optical Lithography
- Plasma Etching
- Thin Film deposition (PVD, CVD, Oxidation, Epitaxy)
- Wet Processing (silicon etching, metal etches)
- Surface Micromachinging of silicon
- LIGA and UV LIGA (Thick resist lithography, electroplating, molding)
- Metrology (including discussion on the applications space for AFMs)
- Scaling laws and their influences on process and design selection
- Novel Applications in MEMS, Semiconductors, and Nanotechnology such as next generation lithography, quantum computing, biological manipulation
2 per Semester
Paper/ 10 min presentation
Grades depend heavily on the student’s ability to understand the concepts behind individual fabrication processes and the ability to apply these concepts collectively toward device design.
Example test questions:
1. Explain the physics involved in reactive ion etching. Of the tool sets available, which type (RIE, microwave asher, ECR, ICP) offers the fastest etch rates and why? Which type is most commonly used for descumbing resist? What is the reason? What was the principle design flaw in ECR technology in the 1990s. What effect did it have on the success of this etch method? Was the replacement method really that much better?
2. Describe the process by which you would fabricate the Texas Instruments DLP micro mirror. Provide descriptions of each particular process step and explain why it was chosen over other means. How is your scheme integrated with the required IC drive circuit. Does your scheme offer flexibility for improvements in the next generation design? If so, explain.
Part 1 - Course introduction
Part 2 - Materials, Definitions, Scaling Laws
Part 3 - Photolithography
Part 4 - Wet Etching
Part 5 - Dry Etching
Part 6 - Thin Film Deposition
Part 7 - Molecular Beam Epitaxy
Part 8 - Semiconductor Diffusion
Part 9 - Ion Implantation
Part 10 - LIGA
Part 12 - MEMS Packaging